Electronics materials

Electromagnetic shielding film LIOELM TSS™ Series

A thermosetting shield sheet that does not have a metal thin film and has both heat resistance and flexibility by specially dispersing conductive adhesives in a heat-resistant urethane resin.

Conductive adhesive sheet LIOELM TSC™ Series

It achieves stable and high conductivity by dispersing conductive filler into our proprietary heat-resistant urethane resin.

3D molded EMI shielding sheet LIOTELAN™ Series

A thermosetting shielding sheet with excellent stretchability and three-dimensional moldability. It achieves shielding effect on high steps and complex shapes, making it ideal for EMI shielding suppression applications in semiconductor packages and component-mounted PCB.

Heat-resistant bonding sheet LIOELM TSU™ 0041SI Series

A heat-resistant thermosetting adhesive sheet to fix FPC reinforcing plates, etc. It can be cured quickly at low temperatures and is designed to withstand the high temperatures of lead-free solder reflow.

Low dk/df heat resistant bonding sheet LIOELM TSU™ 500 Series

It can be used as an interlayer adhesive sheet for multilayer flexible substrates for antennas and millimeter wave radars compatible with 5th generation communications (5G).

Thermal conductive adhesive sheets LIOELM™ FTS Series

A uniquely developed special resin provides both high thermal conductivity (10W/m・K) and flexibility. A thermosetting adhesive sheet with excellent insulation and durability.

3D molded insulation protective sheet LIOTELAN™ Series

A thermosetting insulating protective sheet that can be formed into three dimensions with excellent stretchability and toughness. Any location on the mounting board with height differences can be covered.

Low-dielectric polymer for 5G/high speed communication

Polymer material with low-dielectric constant/dissipation tangent. It also has the characteristics of high heat resistance and low elasticity.