Low-dielectric polymer for 5G/high speed communication

Fifth-generation mobile communication systems (5G) use high frequencies, such as microwave to millimeter wave bands, and are therefore susceptible to transmission loss, requiring low-loss materials that can reduce signal delays and losses during transmission.

Our low-dielectric polymer reduces dielectric loss and achieves stability in high-speed communications such as 5G.

It also has the characteristics of high heat resistance and low elasticity, making it promising for use as next-generation substrate materials and adhesives.

• Product features
• Applications

Product features

Low dielectric constant (Dk) and dissipation factor (Df)

The low-dielectric polymer developed using our unique know-how has low-dielectric properties in the high frequency band required for 5G communications.

It also has high adhesion to substrate materials such as copper foil and polyimide, making it highly adaptable as a substrate material.

Low elasticity

Due to the unique resin skeleton design, it has low elasticity, softness, and ductility. Taking advantage of this feature, it can be used as a stress relaxation layer.
It is also expected to be applied to wearable applications that take advantage of its elasticity.

SS curve

DVA storage modulus

High heat resistance

It also maintains solder heat resistance and is suitable as a board material.

Heating loss

Applications

Various parts of electronic substrates such as interlayer insulation layers and solder resists

Wearable device

Substrate materials applicable to next-generation high-speed communications such as 5G and Beyond 5G

low-dielectric polymer developed using our proprietary resin design technology has excellent low-dielectric properties, low elasticity, and high heat resistance, making it possible to achieve stable high-speed communications such as 5G and Beyond 5G.

In addition, due to its low elasticity, it can be expected to relieve stress, and can be used for base stations and PKG boards, etc. to reduce warpage of the entire board.