Conductive adhesive sheet LIOELM TSC™ Series

The LIOELM TSC™ Series is a thermosetting type that obtains stable high conductivity by dispersing conductive filler in a high heat resistant urethane resin originally developed by ourselves.
Since it is composed of a flexible resin with heat resistance, it has excellent solder reflow and embedding properties.
By electrically connecting the ground circuit of the FPC and the metal reinforcement plate, it has excellent ground strengthening performance.

LIOELM TSC™ 200 Series

• There are thickness variations of 40μm and 60μm to suit the step and opening diameter.
• Demonstrates high adhesion to gold plating and various FPC components.
• Our unique dispersion technology suppresses increases in resistivity over time and provides stable conductivity.
• Our unique dispersion technology provides stable conductivity even under high temperature and high humidity conditions.
• Halogen-free environmentally friendly product. Obtained UL94 flame retardant standard VTM-1

リオエルム TSC® 200シリーズ テクニカルデータシート(日本語)

LIOELM TSC™ 200 Series Technical Data Sheet(EN)