3D molded EMI shielding sheet LIOTELAN™ Series
A thermosetting shield sheet with excellent stretchability and three-dimensional moldability. It achieves shield processing for high steps and complex shapes, and has excellent electromagnetic shielding properties and durability, making it ideal for noise suppression applications in semiconductor packages and electronic boards.
- Product Structure
- Characteristics
- Application example
- Basic physical properties/reliability evaluation
Product structure
Characteristics
It has excellent strechability (elongation rate of 400% or more), and with heat press, it can cover and embed to electronics components on the board.
Application example
3D shield processing of electronic boards
Example 1) Covers the entire surface of the board as an alternative to shield cans, contributing to lower height and space savings.
Example 2) Partial shielding of high-density mounting board
Basic physical properties/reliability evaluation
| Basic physical properties | Test condition | Physical property value |
|---|---|---|
| Thickness | After pressing | 30～50μm |
| Volume resistance value | initial value | 4.0～6.0×10⁻⁵ Ω/cm |
| Young's modulus | 25℃ | 1.8GPa |
| Tg | DMA | 50℃ |
| Reliability evaluation | GND connection resistance value | EMC adhesion cross-cut test |
|---|---|---|
| initial value | 29mΩ | 4B |
| 260℃ solder reflow x 3 passes | 30mΩ | 4B |
| PCT (121℃,100%,96hrs) | 32mΩ | 4B |
| High temperature test (150℃,1000hrs) | 37mΩ | 4B |
| heat cycle test (-55℃～125℃,1000cycles) |
32mΩ | 4B |
*EMC=Epoxy Mold Compound
Inquiries
TOYOCHEM CO., LTD. Information and Communication Materials Sales Division
TEL: +81-3-3272-0905