3D molded insulation protective sheet LIOTELAN™ Series
A thermosetting insulating sheet that can be molded in three dimensions. Using a heat press machine, we can mold and cover any area on the board in one single process and add various functions. Because it has excellent strechability and resilience, it can be covered even on substrates with differences in height.
Characteristics
It has excellent elongation properties (elongation rate of 500 to 700% or more), and, with heat press, it can cover and embed on the substrate. In addition, it is possible to be modified the thickness (15~200μm).
Application example
Add various functions by covering the entire surface or any desired part of the component mounted PCB.
- Protection of parts
- Moisture-proof, waterproof
- Increased board strength
- Low profile, space saving
Basic physical properties/reliability evaluation
| Basic physical properties | Test condition | Physical property value |
|---|---|---|
| Thickness | After pressing | 15～200μm |
| breakdown voltage | - | 170kV/mm |
| Water absorption rate | 23℃, 24hrs | 1.30% |
| Shore D hardness | 23℃ | 100 |
| Linear expansion coefficient | - | a1: 120ppm a2: 200ppm |
| Dielectric properties | 28GHz | DK: 2.8 Df: 0.019 |
| Reliability evaluation | EMC adhesion cross-cut test |
|---|---|
| initial value | 5B |
| 260℃ solder reflow x 3 passes | 5B |
| PCT (121℃,1000hrs) | 4B |
| High temperature test (150℃,1000hrs) | 4B |
| heat cycle test (-55℃～125℃,1000cycles) |
4B |
*EMC=Epoxy Mold Compound
Inquiries
TOYOCHEM CO., LTD. Information and Communication Materials Sales Division
TEL: +81-3-3272-0905