What are the Characteristics of High-performance Materials Needed in the Coming 5G Era?

• High-performance Materials Needed for 5G
• TOYOCHEM 's 5G Product Lineup

High-performance Materials Needed for 5G

The 5th generation mobile communication system (5G) has started in earnest in countries around the world, starting with commercial services in the United States and South Korea in April 2019. Characterized by "high speed, large capacity," "low latency," and "multiple connections," it is expected to play a role as an infrastructure that supports the realization of an advanced information society in a wide range of industrial fields, not just as a service for mobile terminals, as was the case before 4G. In particular, its true value will be demonstrated in fields such as IoT, autonomous driving, and entertainment (VR/AR).

Since 5G uses high-frequency signals in the gigahertz band, it is necessary to "measure against resonance noise" and "suppress transmission loss."

Dealing with resonance noise

High frequency, or short wavelength, signals are more likely to cause resonance on circuits, which can lead to noise problems when designing circuits and boards. One way to counter noise is to apply shielding films to circuit boards, but in the 5G era, materials with better shielding performance that can handle high-frequency signals will be needed.

Suppression of transmission loss

Transmission loss increases in high-speed transmission circuits. Therefore, a design that reduces transmission loss is required by using a material with the lowest possible dielectric constant/dissipation tangent (low-dielectric material).

TOYOCHEM 's 5G Product Lineup

High frequency electromagnetic shielding film LIOELM TSS™ 500 Series

・Excellent shielding performance for high frequency range ・High conductivity
・Uses special urethane resin for excellent bending durability, flexibility, and heat shrinkability.

Electromagnetic shielding film LIOELM TSS™ Series

Low dk/df heat resistant bonding sheet LIOELM TSU™ 500 Series

・Low-dielectric thermosetting adhesive sheet for multilayer flexible substrates
・It combines ` low-dielectric constant/dielectric loss tangent'', "adhesive strength", "heat resistance", and "drillability", which were conventional trade-offs.

Low Dk/Df heat resistant bonding sheet LIOELM TSU™ 500 Series

Low-dielectric polymer for 5G/high speed communication

・Low-dielectric polymer developed using our unique resin design technology
・In addition to excellent low-dielectric properties, it has properties such as low elasticity and high heat resistance.

Low-dielectric polymer for 5G/high speed communication