Developed sintered silver nanobonding material for power electronics

~ Contributing to cost reduction in the power semiconductor manufacturing process with an innovative bonding material that combines pressure-free and high heat dissipation ~

TOYO INK SC Holdings Corporation (President and Representative Director Satoru Takashima, Chuo-ku, Tokyo) has developed a sintered silver nano-junction material that combines sintering without pressure and high heat dissipation for use in electronics products such as power semiconductor chips.

Demand for semiconductors is increasing with the expansion of electric vehicles, and SiC semiconductors are increasingly being adopted because of their low energy loss when adjusting current and voltage. On the other hand, SiC semiconductors have higher operating temperatures than conventional Si semiconductors and require higher heat resistance and heat dissipation properties, so there is a need for a bonding material that can replace the conventional lead-free solder.
The sintered silver nano bonding material developed by TOYO INK SC Holdings is an unprecedented bonding material for power semiconductors that combines pressure-free sintering and high heat dissipation. This product can be directly bonded to a copper substrate, has a thermal conductivity of over 300W/mk, and a bonding strength of over 40MPa*1, and can also be used with thin-film chips and chips with special shapes.
Existing equipment such as solder reflow ovens can be used to sinter a large number of chips at the same time, and sintering can be done in a shorter time (5 to 30 minutes) than conventional products, which not only reduces equipment investment costs but also reduces power consumption. It also contributes to reducing time and energy in the semiconductor manufacturing process. This product is suitable for bonding in-vehicle and electric railway inverter modules, in-vehicle ECUs, high-frequency devices, power ICs, high-output LEDs, etc. that require high heat dissipation. In addition to the non-pressure type, we also have a pressurized type that can suppress damage to chips and base materials by joining uniformly and with low pressure.

Power semiconductors with high power efficiency are one of the key materials for the realization of a decarbonized society. The Toyo Ink Group will contribute to the realization of a sustainable society by solving social issues through the provision of products and services born from its unique technologies.